Rubric: Proceedings - ETG Reports
ETG-Fb. 173: CIPS 2024
larger

Power Engineering Society in the VDE (VDE ETG) (Ed.)

New Book!

ETG-Fb. 173: CIPS 2024

13th International Conference on Integrated Power Electronics Systems, March, 12 – 14, 2024, Düsseldorf, Germany

ETG-Fachberichte

2024, 730 pages, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-6288-0, e-book: ISBN 978-3-8007-6289-7
Personal VDE Members are entitled to a 10% discount on this title

Content Foreword

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:

- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems´ and components‘ operational behaviour and reliability
Die Energietechnische Gesellschaft im VDE (VDE ETG) bündelt im VDE mit über 12.000 Mitgliedern die Fachkompetenz der Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern.
Das umfangreiche Expertenwissen der ca. 300 ehrenamtlichen Mitarbeiter aus Industrie, For-schung, Versorgungsunternehmen, Hochschulen und Behörden, die in Fachbereichen, Fachaus-schüssen und Arbeitskreisen mitwirken, bildet die technisch-wissenschaftliche Basis für ETG-Veranstaltungen und -Publikationen.
Search Conference Papers
1

Digital Twin and Virtual Release of Automotive Electronics

Authors:
Loos, Florian; Schautzgy, Johannes; Obermayr, Martin; Tauscher, Markus; Sova, Libor; Krejcova, Milada
2

Design Automation for Power Electronics: a path towards realization

Authors:
Hermanns, Kevin
3

Unlocking the Opportunities of Bidirectional GaN Devices in Isolated DC/DC Converters and Multilevel Inverters

Authors:
Barzegarkhoo, Reza; Pereira, Thiago; Liserre, Marco
4

Pairing Gate Driver Performance with ISO 26262 Functional Safety Requirements

Authors:
Hornkamp, Michael
5

Soft Magnetic Components: Functional in Practice Despite Tolerances and Calculation Inaccuracies

Authors:
Kampen, Dennis; Owzareck, Michael; Langfermann, Sascha; Fraeger, Lukas
6

The latest material technology to support power module packaging

Authors:
Makihara, Koji; Ukawa, Ken
7

Life-Cycle Carbon Footprints of Low-Voltage Motor Drives with 600-V GaN or 650-V SiC Power Transistors

Authors:
Huber, Jonas; Imperiali, Luc; Menzi, David; Kolar, Johann W.; Musil, Franz
8

Interest of high frequency decoupling inductors for reducing common mode current in high speed switching cells

Authors:
Botter, N.; Bikinga, W. F.; Avenas, Y.; Guichon, J. M.; Schanen, J. L.
9

Investigating the Effect of Voltage and Current Stress on Temperature Dependent On-State Resistance in GaN HEMT Power Devices

Authors:
Li, Tianyu; Lindemann, Andreas
10

An Improved Approach for an Intermediate Measurement Routine of Dynamic On-State Resistance for GaN Power Devices

Authors:
Goller, Maximilian; Franke, Joerg; Li, Gengqi; Mouhoubi, Samir; Curatola, Gilberto; Lutz, Josef; Basler, Thomas
11

Single Supply High Voltage Module with no Auxiliary Bootstrap Network

Authors:
Villani, Claudio; Ruzza, Stefano; Malcovati, Piero; Bonizzoni, Edoardo
12

Evaluation of a Rogowski-based di/dt sensing for temperature monitoring of SiC MOSFET in TO-247 package

Authors:
Jamois, Arthur; Morand, Julien
13

Integration of controllable inductors in hardware in the loop systems

Authors:
Maier, Herbert; Pfeiffer, Jonas; Schmidhuber, Michael
14

Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements

Authors:
Quergfelder, Simon; Sax, Julian; Heckel, Thomas; Eckardt, Bernd; Maerz, Martin
15

Evaluation of the Thermal Fatigue and Failure Mechanisms on Power Modules with Different Types of Substrates (DBC / IMS)

Authors:
Spano, Chiara; Galfré, Giulio; Mattiuzzo, Emilio; D’Ancona, Lorenzo; Bertana, Valentina; Scaltrito, Luciano; Ferrero, Sergio
16

Performance Test of a 450 V Polymer Aluminium Electrolytic Capacitor

Authors:
Ebel, Thomas; Neupane, Shova; Rassmann, Rando; Schuemann, Ulf; Hammerl, Matthias; Greif, Andreas
17

Optimized Super Cascode Circuit for Electrical Testing under High Frequencies, Voltages and Voltage Gradients

Authors:
Huether, Christian; Wels, Sebastian; Raulf, Tobias; Fehmer, Felix
18

Thermomechanical characterisation of soft potting materials and stress reduction by compressibility

Authors:
Wirries, Jonas; Ruetters, Martin
19

Nickel as Phase Growth Accelerator in Ternary Solder Systems

Authors:
Richter, Jessica; Kopczynski, Anna; Schellscheidt, Benjamin; Licht, Thomas
20

Examination of the Pore Structure of Copper Sintered Die Attach Layers by Local Thickness Analysis and Scratch Test

Authors:
Raemer, Olaf; Hutter, Matthias; Schneider-Ramelow, Martin
21

Evaluation of accuracy and performance of an optimized simulation model by measuring a manufactured test vehicle

Authors:
Papperi Devarajulu Deenadayalan, Janagan; Weis, Gerald
22

Development of High-speed Current Switch Box for Transient Thermal Characterization of SiC Power Modules

Authors:
Fukunaga, Shuhei; Funaki, Tsuyoshi
23

Fast Two-Step Sintering Process with High Strength

Authors:
Schellscheidt, Benjamin; Kopczynski, Anna; Richter, Jessica; Licht, Thomas
24

Testing of SiC MOSFETs for short over-current pulses of 1 ms

Authors:
Bhadoria, Shubhangi; Soundhariya, G. S.; Nee, Hans-Peter
25

Analytical Design of a Finite Input Inductance 34.5 MHz Class E Inverter for Wireless Power Transfer

Authors:
Beley, Matthieu; El-Khattabi, Mohamed; Pace, Loris; Breard, Arnaud
26

Systematic evaluation of DC-link capacitors for GaN applications

Authors:
Fricke, Tobias; Mallwitz, Regine
27

Exploring coupling coil integration in Power Semi-Conductor Modules environment for sensing in Railway traction

Authors:
Dumollard, Yannick; Escrouzailles, Vincent; Batista, Emmanuel; Tisne-Grimaud, Damien
28

Why the 3 dB bandwidth of a current sensor does not provide an exact statement about its measurement capability

Authors:
Lutzen, Hauke; Ziegler, Philipp; Roth-Stielow, Joerg; Kaminski, Nando
29

A high voltage DC/AC unipolar converter to drive a piezoelectric actuator with controlled response times

Authors:
Bennacer, Nassim Rayane; Martin, Christian; Pace, Loris
30

Balanced core fluxgate DC current transducers for high precision measurement up to 10 MHz

Authors:
Roland, Buerger; Birkerod Lillholm, Morten; Elbaek, Henrik
31

Voltage-Sensorless Control and GaN Multilevel Converter for Charging Non-Linear and Lossy Electrocaloric Capacitors

Authors:
Moench, Stefan; Reiner, Richard; Basler, Michael; Waltereit, Patrick; Quay, Ruediger; Bartholome, Kilian
32

Technique for Measuring the Capacitance-Voltage Characteristics of GaN and SiC Bidirectional Power Switches

Authors:
Bosch, Michael; Koch, Dominik; Nuzzo, Jeremy; Kallfass, Ingmar
33

Optimal parameters design of bidirectional buck-boost three-level DC-DC converter based on Pareto front for electrochemical energy storage

Authors:
Dou, Zechun; Tan, Bo; Le, Wentao; Qi, Yu; Chen, Yanping
34

A Systematical and Analytical Driver Layout Design Procedure for Parallel GaN GIT Power Semiconductors

Authors:
Peinsipp, Moritz; Sah, Bikash; Sprunck, Sebastian; Jung, Marco
35

Influence of VDS Bias on SiC MOSFET Dynamic Gate Stress

Authors:
Gebhardt, Mathias; Lieser, Gabriel
36

Investigation of TSEPs for junction temperature estimation of GaN and SiC devices in power cycling tests

Authors:
Woehrle, Dennis; Wattenberg, Daniel; Burger, Bruno; Ambacher, Oliver
37

Challenges of Junction Temperature Calibration of SiC MOSFETs for Power Cycling – a Dynamic Approach

Authors:
Breuer, Jakob; Dresel, Fabian; Schletz, Andreas; Klier, Johannes; Leib, Juergen; Maerz, Martin; Eckardt, Bernd
38

A Fast Source to Drain Voltage Measurement in Bridge Topologies Using a Freewheeling Path for Dynamic Power Cycling Tests

Authors:
Baron, Kevin Munoz; Swaroop Dash, Sarthak; Solomakha, Oleksandr; Kallfass, Ingmar
39

Evaluation of failure modes in film capacitors after accelerated lifetime testing compared to field returns

Authors:
Rudolph, Marco; Naumann, Falk; Muehs-Portius, Bolko; Klengel, Sandy; Knoch, Jan
40

Implementation of a Junction Temperature Cycle Recorder in a Battery Electric Vehicle and Accuracy Assessment by Road Testing

Authors:
Denk, Marco; Esau, Marvin; Fritsch, Sascha; Ubben, Ole
41

Accelerated Quality Testing for Coatings in High Voltage Applications

Authors:
Meier, Markus R.; Eckardt, Mirco; Schweigart, Helmut
42

Condition Monitoring of Power Modules for SiC and GaN Semiconductors by Piezoelectric Effect

Authors:
Bickel, Philipp; Jung, Marco; Kriegel, Kai; Donat, Albrecht; Mitic, Gerhard; Walbrecker-Baar, Christian
43

Online Junction Temperature Estimation Based on the Drain Current Rising Edge for SiC MOSFETs

Authors:
Li, Zekun; Yu, Puzhen; Ji, Bing; Cao, Wenping
44

Reliability Analyzes of Power Electronics Encapsulations using (Electrochemical) Impedance Spectroscopy – a first approach

Authors:
Gierth, P.; Gierth, U.; Schneider, M.; Rebenklau, L.; Boyke, M.; Steinacker, P.; Schweigart, H.; Meier, M. R.; Eckardt, M.; Schrems, P.
45

Reducing SMPS Size and Losses with a Novel Piezoelectric EMI Filter

Authors:
Hubert, Florian; Kuebrich, Daniel; Duerbaum, Thomas; Rupitsch, Stefan J.
46

A high-frequency performance and degradation study of adhesive conductive EMI shielding tapes during High-Temperature Storage

Authors:
Seliger, Norbert; Helmbrecht, Cordula
47

Adaptive Dead Time Control for GaN HEMTs Based on a Time- Discrete Extremum-Seeking System

Authors:
Fink, Tobias; Koch, Dominik; Kallfass, Ingmar
48

A three-phase coupled inductor for a medium voltage high power charging system

Authors:
Blaum, Christian; Wrensch, Philemon; Pfeiffer, Jonas; Drexler, Christoph; Schmidhuber, Michael; Derix, David; Hensel, Andreas
49

Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics

Authors:
Avenas, Yvan; Bruyere, Paul; Vagnon, Eric; El Khattabi, Mohamed
50

Test bench for the characterization of two-phase passive immersion cooling of power electronic devices

Authors:
Hugon, Clement; Avenas, Yvan; Flury, Sebastien; Siedel, Samuel
51

Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly

Authors:
Ferber, Moises; Bruyere, Paul; Botter, Nicolas; Can, Alejandro; Bouzerd, Souhila; Guichon, Jean-Michel; Schanen, Jean-Luc; Derbey, Alexis; Vagnon, Eric; Combettes, Celine; Bley, Vincent; Sarraute, Emmanuel; Dupont, Laurent; Avenas, Yvan
52

Accelerated Voltage Endurance Test and Insulation Lifetime Estimation of Silicone-Gel Encapsulated Direct-Bond-Copper Substrates for Medium-Voltage Power Module Packaging

Authors:
Gao, Yuan; Zhang, Zichen; Zintak, Zachary; Arriola, Emmanuel; Aunsborg, Thore Stig; Munk-Nielsen, Stig; Lu, Guo-Quan
53

Die-Level Series-Connection of SiC MOSFETs and Integration of Decoupling Capacitors

Authors:
Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis
54

A Parasitic Extraction Strategy for Four-Terminal Power Devices

Authors:
Weiser, Mathias C. J.; Kallfass, Ingmar
55

Evaluation of Different Diode Technologies in a Si-SiC Hybrid Switch Used in a 540V/30kVA Inverter

Authors:
Andrade, Marco; Cougo, Bernardo; Morais, Lenin M F; Sathler, Gustavo
56

Investigation on failure mechanisms of a PCB based package using DC active power cycling

Authors:
Perrin, Remi; Pichon, Pierre-Yves; Morand, Julien; Le Lesle, Johan; Lefevre, Guillaume
57

DC- and AC-Side EMI Filter Design for an Interleaved Three Phase/Level ANPC High-Power GaN PV Inverter Using Coupled Inductors

Authors:
Wang, Fan; Wagner, Valentin; Sprunck, Sebastian; Dick, Christian; Jung, Marco
58

GaN Power Converter with low inductive hybrid PCB Technology

Authors:
Braun, Gerrit; Wethmar, Julian; Kessler, Jan-Thorben
59

The Reliability of High Temperature Pb-Free Solder for High Power Semiconductor Device Packaging

Authors:
Mat, Maryam; Grant, Thomas; Wang, Yangang; Morshed, Muhammad
60

Novel Low Temperature Alloy for Molded Power Module Soldering to Customized Heatsinks

Authors:
Hertline, Joe; Mayberry, Ryan; Hutzler, Aaron
61

AC Filter Capacitors Reliability and Lifetime in Grid-Tied Inverters

Authors:
Nguyen, Thang; Delincé, François; Meinguet, Fabien; Hilal, Alaa; Garcia-Rojo, Ramon
62

Influence of hard encapsulation onto reliability of soldered die-attach in power modules

Authors:
Sprenger, Mario; Oeztuerk, Beyza; Forndran, Freerik; Sippel, Marcel; Ockel, Manuela; Goth, Christian; Franke, Joerg
63

Estimation of thermo-mechanical Anand model parameters of die-attach materials for power electronics assemblies

Authors:
Fuste, Nauem; Sola, Emma; Avino, Oriol; Perpina, Xavier; Vellvehi, Miquel; Jorda, Xavier
64

Anti-ferroelectric MLCCs with high energy density for DC link applications

Authors:
Gebhardt, Sylvia; Molin, Christian; Neubert, Holger
65

Design, Characterisation and Implementation of PCB Based 3-Φ Coupled Inductors for High Power Density Interleaved DC-DC Converter

Authors:
Le Lesle, Johan; Lefevre, Guillaume
66

Fabrication and characterization of low value embedded resistors for use in PCB embedded RC snubber for more integrated converter.

Authors:
Can-Ortiz, Alejandro; Bley, Vincent; Botter, Nicolas; Avenas, Yvan
67

Multidimensional Switching Loss Analysis of Various 1200 V SiC - Power MOSFET Technologies

Authors:
Schnitzler, Ruben; Dos Santos Gomes, Erine; Koch, Dominik; Rasic, Petar; Kallfass, Ingmar
68

Self-controlled driver circuit optimizing dead time in fast GaN converters

Authors:
Schwarzott, Viktiria; Kuring, Carsten; Wieczorek, Nick; Dieckerhoff, Sibylle
69

Sulphide dendrite growth in semiconductor power modules: Towards mission profile calculations of temperature, humidity, and H2S concentration dependencies

Authors:
Wassermann, Tobias N.; Schilling, Oliver
70

A Methodology to Estimate On-Voltage Degradation of Power Devices According to a Power Cycling Mission Profile

Authors:
Vaccaro, Alessandro; Magnone, Paolo
71

Mission-Profile-Related Evaluation of the Threshold-Voltage Stability of SiC MOSFETs

Authors:
Oliveira, Joao; Meuret, Regis; Coccetti, Fabio; Boldyrjew-Mast, Roman; Herrmann, Clemens; Basler, Thomas; Morel, Herve
72

Reliability Assessment of Modular Multilevel Converters: A Comparative Study of MIL and Mission Profile Methods

Authors:
Ahmadi, Miad; Kardan, Faezeh; Shekhar, Aditya; Bauer, Pavol
73

Modified Approach for the Rainflow Counting Analysis of Temperature Load Signals in Power Electronics Modules

Authors:
Letz, Sebastian A.; Zhao, Dawei; Leib, Juergen; Eckardt, Bernd; Maerz, Martin
74

Horizontal Cracks in PCB Embedded Semiconductor Devices: A Real Problem or a Ghost Hunt?

Authors:
Huesgen, Till; Bhushan Sharma, Ankit
75

Cu-Si3N4 AMB-substrates for circuit boards in power electronics

Authors:
Rost, A.; Kuczynski, M.; Zschippang, E.; Dold, P.; Hoerig, J.; Mosch, S.; dos Santos, S.; Gierth, P.; Winhauer, J.; Pfeiffer, J.; Schilm, J.; Herrmann, M.
76

The Attractions, Challenges, and Potential of Copper Sinter Paste for Power Electronics Applications

Authors:
Duch, Susanne; Gunst, Stefan; Reh, Sascha
77

Ultrasonic Rivet Welding as Signal Technology in Power-Modules

Authors:
Dreps, Florian; Zoellner, Nils; Borghoff, Georg; Guth, Karsten; Strotmann, Guido
78

Evaluating non-isolated chip-assembly with direct liquid cooling

Authors:
Schulz, Martin; Klemmer, Ralf; Kreiner, Lukas
79

Investigation of thermo-mechanical fatigue in lateral GaN power transistors with variable switching and conduction losses

Authors:
Hein, Lukas; Schwabe, Christian; Goller, Maximilian; Basler, Thomas
80

Aging of Insulation Materials under Repetitive Impulse Voltage Stress

Authors:
Claudi, Albert; Fehmer, Felix; Raulf, Tobias; Klengel, Robert
81

Energy Balancing in Paralleled SiC MOSFETs During an Avalanche Event

Authors:
Herrmann, Clemens; He, Mengdi; Alaluss, Mohamed; Basler, Thomas; Elpelt, Rudolf; Zeng, Guang
82

Characterisation of 1200 V SiC-MOSFETs - Influence of Repetitive Short-Circuit Events on Device Parameters

Authors:
Brandt, Soenke; Rasch, Martin; Wanagat, Tim; Hoffmann, Klaus F.
83

Investigation of Moisture Absorption and Drying Characteristics of HVIGBT Power Modules

Authors:
Sakai, Yasuhiro; Mikami, Kazuto; Hatori, Kenji; Nakamura, Keiichi; Oya, Daisuke; Soltau, Nils
84

Step-Change in HV-H³TRB Performance of Latest Silicon IGBTs and Advanced Humidity Testing Methods

Authors:
Peters, Jan-Hendrik; Hanf, Michael; Clausner, Sven; Kaminski, Nando
85

Automatic Generation of Thermal Models for PCB-based Power Electronics

Authors:
Hamed, Bahaeddine Ben; Ahmed, Ahmed Sabry Eltaher; Regnat, Guillaume; Perrin, Remi; Lefevre, Guillaume; Buttay, Cyril; Jay, Jaques
86

Optimizing Power Modules by Enhancing Power Density, Ease of Implementation and Supporting Automotive Reliability Requirements

Authors:
Mueller, Holger; Stallmeister, Marco; Spitzer, Dietmar
87

Thermo-mechanical and electromagnetic simulations of a Half-Bridge Insulated Prepackage for Modular Power Modules

Authors:
Frroku, Saimir; Sharma, Ankit Bhushan; Huesgen, Till; Irace, Andrea; Salvatore, Giovanni A.
88

Effect of local concavity of DBC substrate on junction-to-heatsink thermal resistance of power module designs

Authors:
Csiki, Daniel; Buza, Mate; van Dijk, Marius; Tauer, Matthias; Wittler, Olaf
89

Achieving SiC Power modules with high heat dissipation by Developing New Bonding Material

Authors:
Hayashi, Kenji; Tanikawa, Kohei; Sato, Oji; Ishibashi, Takaharu; Hayashiguchi, Masashi; Otsuka, Takuazu; Wakamoto, Keisuke; Noma, Tsuguki; Mostafa, Noah; Filsecker, Felipe
90

Surge Current Test of SiC MOSFET with Planar Assembly and Joining Technology

Authors:
Ye, Yijun; Hensler, Alexander; Botazzoli, Pietro; Bigl, Thomas; Schmidt, Ralf; Basler, Thomas; Lutz, Josef
91

Impact of VCE,sat measurement conditions on cycle-to-failure determination of IGBT samples in power cycling test

Authors:
Zhang, Yichi; Zhang, Yi; Yao, Bo; Wang, Huai
92

Influence of Current Density on Power Cycling Test of Low Voltage MOSFETs in DC Body-Diode Mode and Switching MOSFET-Mode

Authors:
Abuogo, James; Schwabe, Christian; Lutz, Josef; Basler, Thomas
93

Substantial increase of power cycling capability of SiC MOSFETs after preconditioning

Authors:
Kempiak, Carsten; Lindemann, Andreas
94

Milliseconds Power Cycling (PCmsec) driving bipolar degradation in Silicon Carbide Power Devices

Authors:
Laha, S.; Leib, J.; Maerz, M.; Schletz, A.; Liguda, C.; Faisal, F.; Momeni, D.
95

Improvement of PC ruggedness by AlN substrate in Easy power modules with Silicon Carbide technology

Authors:
Methfessel, Torsten; Zhou, Meng-Meng; Mier, Ainhoa Puyadena; Salmen, Paul
96

Impact of the Level of Negative Gate Voltage on the Temperature Measurement during Power Cycling Testing of SiC MOSFETs

Authors:
Heimler, Patrick; Reiter, Kristiane; Guenther, Marco; Lutz, Josef; Basler, Thomas
97

Recycling potential of power electronics solutions – an exemplary study about on-board chargers

Authors:
Minke, Christine; Burfeind, Paula; Mallwitz, Regine; Hu, Daiyi
98

Current Ripple Reduction Approaches in a Heavy-Duty Fuel Cell Truck

Authors:
Guerlek, Yavuz; Akerl, Martin; Pfeifer, Kristina; Dold, Roland; Sippl, Simon; Lang, Charlotte; Basler, Thomas; Piriienko, Stanislav; Neuburger, Martin
99

Time-Domain Simulation Based Multi-Domain Optimization of Gallium Nitride-Based DC/DC Converters utilizing Spice Models

Authors:
Nuzzo, Jeremy; Koch, Dominik; Bosch, Michael; Fink, Tobias; Kallfass, Ingmar
100

Switching Behaviour of 3-Level Flying Capacitor GaN Half Bridge on a Multilevel AMB Substrate with integrated DC-Link Capacitor

Authors:
Wituski, Janusz; Kleimaier, Alexander
101

Hyperbolic Segmentation of Gate Driver Output Transistors for a Clean Switching of 650V GaN HEMTs Half Bridges

Authors:
Fiori, Franco; Nuebling, Marcus; Klotz, Frank
102

Ensuring optimal switching of power MOSFETs by compensating Vth variations using an integrated active gate driver

Authors:
Feng, Zhengyang; Kumar, Manish; Wang, Sheng; Kawai, Shusuke; Ueno, Takeshi; Ishihara, Hiroaki; Onizuka, Kohei
103

Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?

Authors:
Iannuzzo, Francesco
104

Reliability of GaN power chip embedding in different stack up

Authors:
Hammerl, Matthias; Abouie, Maryam; Rugen, Sarah; Sami, Alexander; Allirand, Laurence; Dresel, Fabian; Leib, Juergen
105

Development and testing of GaN Power Modules for EV traction inverters.

Authors:
Novo, Dima; Briga, Adam; Bunin, Gregory; Bunin, Ilia; Cohen, Oren; Chang, Joey; Dubinsky, Oleg; Firtel, Alex; Gitelmakher, Yuri; Iskhakbayev, Nissim; Liesabeths, Dieter; Montazeri, Mahsa; Romero, Memo; Rozanov, Evgeny; Shapiro, David; Stessin, Lev; Tsai, Ray; Volkov, Roman; Veprinsky, Valery; Veprinski, Dana; Roiter, Yulia; Wainwright, Simon
106

Is the Motor Insulation System Really Affected by High Voltage Transients?

Authors:
Fuerst, Markus; Bakran, Mark-M.
107

Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader

Authors:
Ahmed, Ahmed Sabry Eltaher; Hamed, Bahaeddine Ben; Perrin, Remi; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril; Jay, Jaques
108

Double-Side Cooled 1.2kV, 300A SiC MOSFET Phase-leg Modules for 200 kW, > 100 kW/L Traction Inverters

Authors:
Zhang, Zichen; Lu, Guo-Quan; Zhao, Xingchen; Dong, Dong; Arriola, Emmanuel; Ubando, Aristotle; Gao, Yuan
109

Power Cycling of Discrete SiC Power MOSFET Packages: Electro- Thermo-Mechanical Modeling of Bondwires

Authors:
Kovacevic-Badstuebner, Ivana; Hirth, Fabian; Race, Salvatore; Mengotti, Elena; Bianda, Enea; Jormanainen, Joni; Grossner, Ulrike
110

Dynamic calibration: How to properly estimate junction temperature in SiC MOSFETs subject to body diode voltage shift

Authors:
Noah, Mostafa; Fuentes, Carlos; Filsecker, Felipe