Automatic Generation of Thermal Models for PCB-based Power Electronics
Conference: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
03/12/2024 - 03/14/2024 at Düsseldorf, Germany
Proceedings: ETG-Fb. 173: CIPS 2024
Pages: 7Language: englishTyp: PDF
Authors:
Hamed, Bahaeddine Ben; Ahmed, Ahmed Sabry Eltaher; Regnat, Guillaume; Perrin, Remi; Lefevre, Guillaume (Mitsubishi Electric R&D Centre Europe, Rennes, France)
Buttay, Cyril (CNRS, INSA-Lyon École Centrale de Lyon Universite Claude Bernard Lyon 1, Villeurbanne, France)
Jay, Jaques (INSA Lyon, CNRS, CETHIL, Villeurbanne, France)
Abstract:
An automated workflow transforms the board design of a power converter circuit into a thermal equivalent-circuit model (TECM) that describes the thermal behaviour of power chips. It uses commercial software (Altium, ANSYS Icepak, LTSpice), with custom code handling data transfer and model preparation in between. Some systematic simplifications are proposed to speed up the calculation. This workflow is illustrated using an example case and the results are compared with experimental measurements (thermal impedance measurement).