A high-frequency performance and degradation study of adhesive conductive EMI shielding tapes during High-Temperature Storage
Conference: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
03/12/2024 - 03/14/2024 at Düsseldorf, Germany
Proceedings: ETG-Fb. 173: CIPS 2024
Pages: 7Language: englishTyp: PDF
Authors:
Seliger, Norbert; Helmbrecht, Cordula (Technical University of Applied Sciences Rosenheim, Germany)
Abstract:
The variation of the contact impedance of adhesive conductive EMI shielding tapes under high temperature storage (HTS) of 110 °C. is investigated. The adhesive tapes under test are implemented as signal return paths in microstrip lines. Changes in the ground plane impedance by adhesive deterioration are analyzed by S-parameter measurements from 1MHz to 3GHz. A circuit model for contact impedance degradation is proposed and applied in simulation of board level shielding. Contact resistance and contact capacitance are found to increase significantly after 2400h, causing a declined magnetic field shielding effectiveness by 30 dB below 500 MHz.