Test bench for the characterization of two-phase passive immersion cooling of power electronic devices

Abstract:
Two-phase immersion cooling of power semiconductor devices receives a renewed interest thanks to the development of more environment-friendly phase-change and isolating fluids to extract increasing heat flux densities. In order to evaluate this cooling method, a thermo-sensitive electrical parameter is used to measure the temperature of power components during dissipation in condition close to actual ones. In this article, a test bench for the thermal characterization of pool boiling in HFE-7200 is presented as well as the measuring method, which gives an uncertainty on the temperature meas-urement lower than 0.44 °C. Thanks to this test bench, the thermal behaviour of immersed power devices can be charac-terized. Particularly, it allows measuring thermal resistance, maximal heat dissipation, and dynamic thermal response of devices.