Single Supply High Voltage Module with no Auxiliary Bootstrap Network
Conference: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
03/12/2024 - 03/14/2024 at Düsseldorf, Germany
Proceedings: ETG-Fb. 173: CIPS 2024
Pages: 7Language: englishTyp: PDF
Authors:
Villani, Claudio; Ruzza, Stefano (Infineon Technologies, Pavia, Italy)
Malcovati, Piero; Bonizzoni, Edoardo (Università degli Studi di Pavia, Pavia, Italy)
Abstract:
In this paper, the design and the experimental characterization of a single supply high voltage Intelligent Power Module (IPM) with integrated bootstrap supply network are presented. The proposed IPM is based on CoolMOS (TM) Super Junction (SJ) power MOSFETs, a high voltage half-bridge (HB) gate driver and a silicon capacitor co-packaged in a 8x9 mm2 QFN package. The IPM has been tested in real application conditions and the results have shown that the integrated bootstrap circuit is correctly supplying the high-side part of the gate driver. A comparison with an identical device, but with an external bootstrap capacitance, is also presented.