Digital Twin and Virtual Release of Automotive Electronics

Conference: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
03/12/2024 - 03/14/2024 at Düsseldorf, Germany

Proceedings: ETG-Fb. 173: CIPS 2024

Pages: 7Language: englishTyp: PDF

Authors:
Loos, Florian (ZF Friedrichshafen AG, Auerbach i.d. Oberpfalz, Germany)
Schautzgy, Johannes; Obermayr, Martin; Tauscher, Markus (ZF Friedrichshafen AG, Friedrichshafen, Germany)
Sova, Libor; Krejcova, Milada (ZF Engineering, Plzen, Czech Republic)

Abstract:
Testing and validation of automotive components represents a major cost driver in the development of electrical devices. Virtual release and integration of simulation into the validation process via digital twin is an effective way to reduce costs and testing times. We show how virtualization can support the process of releasing electrical components, how the entire process needs to be defined, which requirements the simulation methods must fulfill and how to implement the process. As an example, we focus on the PTCE test (Powered Thermal Cycle Endurance) for power electronics to show practical application of our approach.