The latest material technology to support power module packaging

Abstract:
Power module package is driven by the ever increasing demand for high-efficiency power conversion, power-quality correction, renewable-energy systems, energy-storage systems, and electric vehicles. Continuous advancement in power module performance required innovations in areas of both chip design as well as effective packaging technologies. The choice of packaging materials directly influent the design and implementation of the packaging technology, and together, they play crucial roles in determining the performance, reliability and efficiency of these electronic devices. This abstract focus on the innovation on some of key packaging materials such as epoxy encapsulation material, high thermal adhesive material, high reliability chip coating material, and high thermal sheet material, towards higher power module performance. Power modules innovation aims at capability of handling higher voltage and current levels to meet the demand. This leads to larger amount of heat generated, hence higher chip junction temperature. Consequently, the components of power module are required to withstand increasing challenging condition of high current, voltage and temperature to meet the long-term reliability requirements. Additionally, heat dissipation ability is also a crucial material property to support effective thermal management of power module. In respond to above requirements, latest innovative technologies have been incorporated in the development of key materials that offer desired properties required for optimum overall power module performance.