The Attractions, Challenges, and Potential of Copper Sinter Paste for Power Electronics Applications

Abstract:
In this study we compare robustness and performance of interconnects formed by pressure-assisted sintering using each copper (Cu)- and silver (Ag)-sinter paste materials. Focusing on novel Cu-sintering, process parameters and their impact on joint performance and reliability are assessed through shear strength measurements, temperature cycling tests and microstructural analysis. Results show stable performance of the Cu interconnect, though starting with lower initial shear strengths compared to Ag. Strength of sintered Cu joints increases significantly during thermal cycling. Sintered Cu demonstrated favorable cohesive fracture behavior and diffusion properties when applied on Cu-surface.