Rubrik: Proceedings - ETG-Fachberichte

Power Engineering Society in the VDE (VDE ETG) (Hrsg.)

ETG-Fb. 165: CIPS 2022

12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany

ETG-Fachberichte

2022, 516 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-5757-2, E-Book: ISBN 978-3-8007-5758-9
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

217,00 € CD-Rom 217,00 € E-Book/PDF

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems‘ and components‘ operational behavior and reliability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

Die Energietechnische Gesellschaft im VDE (VDE ETG) bündelt im VDE mit über 12.000 Mitgliedern die Fachkompetenz der Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern.
Das umfangreiche Expertenwissen der ca. 300 ehrenamtlichen Mitarbeiter aus Industrie, For-schung, Versorgungsunternehmen, Hochschulen und Behörden, die in Fachbereichen, Fachaus-schüssen und Arbeitskreisen mitwirken, bildet die technisch-wissenschaftliche Basis für ETG-Veranstaltungen und -Publikationen.

Dieser Tagungsband enthält folgende Beiträge, die Sie einzeln als PDF-Download erwerben können:

Zur erweiterten Tagungsbeitragssuche

Highly Integrated Ultra-Compact Three-Port Converter Systems for Automotive Applications

Autoren: Schaefer, Jannik; Kolar, Johann W.

Artificial Intelligence and Long-term Performance of Power Electronics Systems

Autoren: Zhao, Shuai; Peyghami, Saeed; Gebbran, Daniel; Dragicevic, Tomislav; Wang, Huai; Blaabjerg, Frede

Power embedding

Autoren: Gottwald, Thomas; Martina, M.; Marczok, C.; Laumen, M.; Flieger, B.; Wendt, O.

Review of Electric Field Reduction Methods for Medium-Voltage Power Modules

Autoren: Cairnie, Mark; DiMarino, Christina

Power module packaging comprising direct pressed substrate with su- perior thermal performance and reliability

Autoren: Tauer, Matthias; Jappe, Tiago; Panyik, Tamas; Gyimothy, Zsolt; Buza, Mate

Efficiency improvement potential of fast switching 1200 V SiC-DSC-module for automotive traction inverters up to 300 kW

Autoren: Sorge, Jordan; Lis, Adrian; Kusch, Ruediger

SiC automotive power module with laser welded, ultra low inductive terminals and up to 900Arms phase current

Autoren: Beckedahl, Peter; Bogen, Ingo; Steger, Juergen

Advanced cooling concept based on standard power modules significantly improves lifetime

Autoren: Buschhorn, Stefan; Mainka, Krzysztof; Vogel, Klaus

Pareto front system optimization on the example of a motor drive

Autoren: Hoffmann, Stefan; Hoene, Eckart

Evaluation of a Nonlinear Resistive Polymer-Nanoparticle Composite for Field-Grading in a Double-Side Cooled 10-kV Silicon Carbide Rectifier Module

Autoren: Zhang, Zichen; Ngo, Khai D.T.; Sung, Woongje; Lu, Guo-Quan

Influence of Non-Stoichiometric Silicon Nitride Layer Thickness on Electrical Properties and Manufacturability of 900 V Silicon RC-Snubbers

Autoren: Becker, Tom; Boettcher, Normen; Erlbacher, Tobias

GaN-HEMT Based Test Setup for Measurement of Core Losses Under DC-Bias

Autoren: Kohlhepp, Benedikt; Kuebrich, Daniel; Duerbaum, Thomas

3-D Electrothermal Modeling of SiC Multichip Power Modules for a More Accurate Reliability Assessment

Autoren: Race, Salvatore; Stark, Roger; Kovacevic-Badstuebner, Ivana; Nagel, Michel; Ziemann, Thomas; Tsibizov, Alexander; Grossner, Ulrike

Substrate Bias Effects up to 400 V of Normally-On GaN-on-AlN/SiC HEMTs in Static and Dynamic Tests

Autoren: Heucke, Soeren; Hilt, Oliver; Geng, Xiaomeng; Kuring, Carsten; Wuerfl, Joachim; Dieckerhoff, Sibylle

Design and Optimization of the Driver Circuit for Non-Insulating Gate GaN-Transistors Enabling Fast Switching and High-Frequency Operation

Autoren: Geng, Xiaomeng; Kuring, Carsten; Hilt, Oliver; Wolf, Mihaela; Wuerfl, Joachim; Dieckerhoff, Sibylle

Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation

Autoren: Sprenger, Mario; Forndran, Freerik; Ottinger, Bettina; Braun, Tobias; Franke, Joerg

Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC)

Autoren: Dresel, Fabian; Leib, Juergen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy

Aging of Insulation Materials under Repetitive Impulse Voltage Stress with high dv/dt

Autoren: Claudi, Albert; Braun, Gerrit; Klengel, Robert; Klengel, Sandy; Zacharias, Peter; Yu, Xiao

In-situ Detection of Degradation in Power Electronic Modules During Lifetime Testing using Lock-in Thermography

Autoren: Schiffmacher, Alexander; Malasani, Shreyas; Prescher, Mario; Kirste, Lutz; Wilde, Juergen

Thermal grease pump-out visualizing system for power modules using 3D digital image correlation method

Autoren: Manzen, Issei; Omura, Ichiro

Silver-free thick film copper bonding for highly reliable metal ceramic substrates

Autoren: Schwoebel, Andre; Fabian, Benjamin; Schnee, Daniel; Rauer, Miriam; Miric, Anton; Gunst, Stefan

Investigation of element enrichment in silicone gels used to encapsulate inverter modules for renewable power generation

Autoren: Giebel, Elisabeth; Boettge, Bianca; Klengel, Sandy

Self-healing encapsulation material for auto-repairable power module architectures

Autoren: Arati, Baptiste; Bley, Vincent; Brandelero, Julio; Teyssedre, Gilbert

Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding

Autoren: Hagedorn, Oliver; Broll, Marian; Kirsch, Olaf; Hemsel, Tobias; Sextro, Walter

Design and Evaluation of a Building Block for a 100kW DC/DC Converter Based on PCB Process

Autoren: Morand, Julien; Perrin, Remi; Le Lesle, Johan; Lefevre, Guillaume

Condition monitoring and evaluation of Ron degradation during power cycling in switching mode of SiC-Mosfets power modules

Autoren: Ibrahim, Ali; Lallemand, Richard; Khatir, Zoubir; Berkani, Mounira; Ingrosso, Damien

The limited usability of a ZTC-point in tracking IGBT degradation

Autoren: Schlottig, Gerd; Firla, Marcin; Goncalves de Medeiros, Helton; Halonen, Arttu; Ingman, Jonny; Vulli, Aleksi; Mengotti, Elena; Bianda, Enea

Investigation of long-term drift effects of SiC MOSFETs under power cycling like gate conditions

Autoren: Kempiak, Carsten; Lindemann, Andreas

Power Cycling Lifetime of Shunt Resistors in IGBT Modules

Autoren: Schmidt, Ralf; Kaesbauer, Michael; Endres, Michael; Sippel, Marcel; Botazzoli, Pietro

The Effect of Parallel-Connected Varistor on UIS Robustness of SiC MOSFETs for Solid-State Circuit Breakers Application

Autoren: Lou, Zaiqi; Zhu, Yunjie; Nishizawa, Shin-ichi; Saito, Wataru

Packaged β-Ga2O3 Schottky Diodes with Reduced Thermal Resistance by Substrate Thinning to 200μm

Autoren: Wilhelmi, Florian; Komatsu, Yuji; Yamaguchi, Shinya; Uchida, Yuki; Nemoto, Ryoichi; Lindemann, Andreas

Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate

Autoren: Sippel, Marcel; Schmidt, Ralf; Rau, Fabian; Bretscher, Daniel; Seidel, Reinhardt; Franke, Joerg

Module concept for more sustainability without compromising performance: New EconoDUAL(TM) 3 Black Series

Autoren: Vogel, Klaus

Development of an over temperature detection method via internal and emulated gate resistance

Autoren: Kawahara, Chihiro; Izuo, Shin-ichi; Brandelero, Julio; Degrenne, Nicolas

Presentation of a Reliable Molded Power-PrePackage

Autoren: Thomas, Tina; Raemer, Olaf; Nguyen, Thanh Duy; Hoene, Eckart; Braun, Tanja; Liu, Chunlei; Pavlice, Niko

Feedback Controlled IPM Inverter with Single PCB Rogowski Coil Sensor

Autoren: Bayarkhuu, Battuvshin; Bat-Ochir, Bat-Otgon; Omura, Ichiro

Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis

Autoren: Brand, Sebastian; Koegel, Michael; Altmann, Frank; Bach, Linh

Patterning and CTE-matching of contacts to optimize thermomechanical stress in power semiconductor pre-packages

Autoren: Pavlicek, Niko; Liu, Chunlei; Stalder, Patrick; Salvatore, Giovanni; Mohn, Fabian; Huesgen, Till; Thomas, Tina

An Integrated IGBT Module for Dual Inverter Applications

Autoren: Li, Jianfeng; Ma, Yaqing; Dong, Fangfang; Du, Yuekang; Arcillas, Joseph Castillo; Yan, Jiayi

Direct / indirect impinging air jet cooling for power devices and application to power electronics system

Autoren: Nakata, Shunichiro; Omura, Ichiro

Model reduction for sensitivity analysis of solder joint fracture in power electronic modules

Autoren: Schuler, Louis; Khatir, Zoubir; Berkani, Mounira; Ouhab, Merouane; Degrenne, Nicolas

Development of High Reliability Power SiC Module Platform Packag-ing for Low Carbon Vehicles

Autoren: Wang, Yangang; Harris, Anne; Liu, Guoyou; Li, Xiang; Morshed, Muhammad

Reliability Enhancement of High-Power Semiconductor Modules with Insulated Metal Baseplate and Epoxy Encapsulation

Autoren: Wang, Yangang; Morshed, Muhammad; Wei, Si; Grant, Thomas; Longley, Daniel; Li, Xiang; Chang, Guiqin; Liu, Guoyou

Stability Modeling for Multichip SiC MOSFET Power Modules

Autoren: Shen, Yanfeng; Dong, Xiaoting; Schuetz, Tobias; Roesner, Robert

Self-turn-on-free criteria for MOS gate power device and circuit

Autoren: Nishio, Takanao; Omura, Ichiro

PCB-Embedded Packaging for Ultra-Fast Switching of SiC MOSFETs

Autoren: Risch, Raffael; Biela, Juergen

Automatic Model Generation for PCB-based Power Electronics

Autoren: Ben Hamed, Bahaeddine; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril

Electromagnetic switching cell design for fast switching semiconductors

Autoren: Klein, Kirill

A gate driver for on-line heat-treatment to extend the lifetime of multichip power modules

Autoren: Quemener, Vincent; Le Lesle, Johan; Pichon, Pierre-Yves; Brandelero, Julio Cezar; Degrenne, Nicolas

PWM power cycling of a multichip power module with active die tem- perature equalization

Autoren: Brandelero, Julio

Use of a SPICE-based Transfer Function to Model the Absolute Humidity in a Power Semiconductor Module

Autoren: Quittard, Olivier; Ceccarelli, Edoardo; Gloor, Thomas; Paques, Gontran

Comparison of Different Methods for the Characterization of Online Junction Temperature of a Gallium-Nitride Power Transistor

Autoren: Sharmaa, Kanuj; Hueckelheim, Jan; Munoz Baron, Kevin; Ruthardt, Johannes; Kallfass, Ingmar

Rugged and fast short circuit detection method for GaN HEMT based on saturation detection

Autoren: Schmitz, Jan; Meissner, Markus; Bernet, Steffen

Design of high-to-low voltage, low-power integrated isolated DC/DC converters for automotive applications

Autoren: Foray, Etienne; Martin, Christian; Allard, Bruno

Inverter Integration Strategy for a Modern Compact Motor Drive based on SiC

Autoren: Goerdes, Jan Philipp; Schnack, Jasper; Stolley, Jan; Schuemann, Ulf; Eisele, Ronald

Algorithmic Optimisation of Chip Dimensions and Layout Pattern in Press-Pack IGBT Devices

Autoren: Simpson, Robin; Wang, Yangang; Nicholson, Michael; Bell, Daniel

Characterization of a 25V GaN d-HEMT Device through Large Signal Gate Charge Measurements and In-Converter Testing

Autoren: O’Sullivan, Brendan; Fiebig, Norbert; Benkhelifa, Fouad; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus

High-Voltage, Low ESR Solid Electrolyte E-Caps for Automotive applications

Autoren: Buhrkal-Donau, Steffen; Gruia, Mihaela; Ebel, Thomas

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Autoren: Ahmad, Faheem; Aunsborg, Thore Stig; Beczkowski, Szymon Michal; Munk-Nielsen, Stig; Jorgensen, Asger Bjorn

Cooling Concept and Molding Packaging for PV Module Integrated Micro-Inverters

Autoren: Manthey, Tobias; Ranft, Paul; Friebe, Jens

Evaluation of the thermal contact resistance between bulk copper and metal foam using transient measurements

Autoren: Janod, Goulven; Avenas, Yvan; Bouvard, Didier; Khazaka, Rabih

Laser welding of copper terminals on ceramic substrates for power module packaging

Autoren: Dellert, Armin; Schirmer, Stefan; Kolb, Nadja; Kimmel, Michael; Goebl, Christian; Besendoerfer, Kurt Georg

An Embedded Power Section with GaN HEMTs

Autoren: Li, Tianyu; Voigt, Christian; Lindemann, Andreas; Erhardt, Eugen; Boettcher, Lars

Substrate Integrated Temperature Sensing for Bondless Power Modules

Autoren: Riefer, Manuel; Winkler, Jonathan; Strache, Sebastian; Kallfass, Ingmar

Reliability investigation of SiC MOSFETs under switching operation in various packages

Autoren: Schwabe, Christian; Thoenelt, Nick; Basler, Thomas

Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ΔT-Profiles

Autoren: Kostynski, Daniel; Sack, Steffen; Sievers, Markus

An evaluation of Cu-to-Cu ultrasonic welding bond through thermal cycling

Autoren: De, Meghna; Agyakwa, Pearl A.; Arjmand, Elaheh; Mouawad, Bassem; Neate, Nigel; Steinhoff, Stefan; Johnson, C. Mark

Corrosion in Power Electronics

Autoren: Meier, Markus R.; Schweigart, Helmut

Chemical Substrate Treatment for Improved Pressureless Silver Sintering Adhesion of Power Electronics Dies

Autoren: Steiner, Felix; Wurst, Helge; Blank, Thomas

AlON gate dielectric and gate trench cleaning for improved reliability of vertical GaN MOSFETs

Autoren: Goncalez Filho, Walter; Borga, Matteo; Geens, Karen; Cingu, Deepthi; Chatterjee, Urmimala; You, Shuzhen; Bakeroot, Benoit; Decoutere, Stefaan; Knaepen, Werner; Arnou, Panagiota; Homm, Pia

Large surface area substrate attach in power module applications

Autoren: Rabay, Battist; Stelzer, Adrian

Change in SiC MOSFET body-diode voltage drop in TO-247 packages during inverse-mode and forward-mode power cycling test

Autoren: Singh, Bhanu Pratap; Farjah, Amin; Chaudhury, Khaled Redwan; Norrga, Staffan; Nee, Hans-Peter

Potential failure modes of cement-based encapsulation concepts for reliable power electronics

Autoren: Naumann, Falk; Boettge, Bianca; Klengel, Sandy

Investigation of reliability issues in sintered silver interconnected power devices and its lifetime prediction by FEM and experiment

Autoren: Mathew, Anu; Dudek, Rainer; Otto, Alexander; Scherf, Christina; Rzepka, Sven; Subhaiah, Nilavzhagan; Arvind Rane, Kashmira; Wilde, Juergen