Model reduction for sensitivity analysis of solder joint fracture in power electronic modules

Inhalt:
This work develops an effective model reduction technique for parametrized thermo-mechanical problems encountered with power electronic modules. The model reduction relies on the Proper Generalized Decomposition (PGD) method. The method is first illustrated on a weakly coupled linear thermo-mechanical model, where a Basquin fatigue law models the lifetime. The PGD method is then applied to a nonlinear strongly coupled problem, with crack propagation in the solder joint. By increasing the module thermal resistance, the crack propagation affects both thermal and mechanical behaviors. The reduced-order model enables rapidly assessing the impact of design parameters on the module lifetime and is of paramount importance for multi-query context. The reduced-order model is illustrated through several numerical experiments.