Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)

Inhalt:
The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-nected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies coated with LDS-compatible powder, allowing conductor paths to be structured and metallised on the coating. The me-tallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters.