Presentation of a Reliable Molded Power-PrePackage

Inhalt:
Present paper introduces a package alternative to commercially available single power chips, embedded into printed circuit boards on chip scale size. It addresses assembly and interconnect technology for power electronic devices, namely the packaging of bare power dies into a robust package with superior thermal performance and reliability. Use of Cu columns as top side contact and isotropic encapsulation material enable highly reliable packages with thermal path on bottom and top side. The study investigates the feasibility of applied assembly and encapsulation processes regarding mass production. Package reliability has been evaluated by Active Power Cycling and Moisture Sensitivity Level tests.