Self-healing encapsulation material for auto-repairable power module architectures
Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany
Tagungsband: ETG-Fb. 165: CIPS 2022
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Arati, Baptiste (LAPLACE, University of Toulouse; CNRS UPS, INPT, Toulouse, France & Mitsubishi Electric R&D Centre Europe, Rennes, France)
Bley, Vincent; Teyssedre, Gilbert (LAPLACE, University of Toulouse; CNRS UPS, INPT, Toulouse, France)
Brandelero, Julio (Mitsubishi Electric R&D Centre Europe, Rennes, France)
Inhalt:
A self-healing polymer intended to printed circuit boards (PCBs) insulation has been implemented. The applicability of this new material to PCB manufacturing and recovery of properties on mechanical and electrical standpoints are investigated. The research points to enhanced reliability for future architectures of integrated power modules.