Power module packaging comprising direct pressed substrate with su- perior thermal performance and reliability
Konferenz: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15.03.2022 - 17.03.2022 in Berlin, Germany
Tagungsband: ETG-Fb. 165: CIPS 2022
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Tauer, Matthias; Jappe, Tiago (Vincotech GmbH, Munich, Germany)
Panyik, Tamas; Gyimothy, Zsolt; Buza, Mate (Vincotech Kft, Biscke, Hungary)
Inhalt:
Direct pressed substrate technology is demonstrated for power module packaging implementation aiming for superior thermal performance with improved reliability.The proposed technology gives several benefits like even DCB pressure distribution, lower value spread of thermal resistance and less risk of ceramic crack due to less stress gradients. All of the aforementioned features cumulate to higher power density in the end application and improved reliability.