Advanced cooling of power electronics with copper cold sprayed aluminium heatsinks & busbars.
Konferenz: PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.08.2024-30.08.2024 in Shenzhen, China
doi:10.30420/566414091
Tagungsband: PCIM Asia 2024
Seiten: 3Sprache: EnglischTyp: PDF
Autoren:
Singh, Reeti; Kondas, Jan; Meinicke, Max; Holzgassner, Leonhard; Brotsack, Markus
Inhalt:
Cold spray (CS) technology is a well-established technique for metallic deposits in various industries. CS process is known to deposit the powder particles in a solid state far below the melting point of the materials; as a result, common problems associated with temperatures, such as high-temperature oxidation, thermal stresses, and phase transformation, can be avoided. Moreover, cold spray offers short production times, unlimited component size capability, and flexibility for localized deposition. In recent years, CS technology has been extensively used for electrical applications, e.g., cold-sprayed copper for heat sinks, busbars, heat exchangers, and refrigeration units. The present work demonstrates the properties of cold-sprayed copper and its utilization for hybrid heat sink and busbar applications. The results illustrate that the properties of cold-sprayed Cu in the as-sprayed state are comparable with bulk-Cu with 98% IACS electrical conductivity and thermal conductivity of 368 W/mK. Perfectly gas-tight Cu-deposits with a He-leakage rate smaller than 1×10-7 mbar-l/s have been produced.