Intelligent SiC Power Module for 2- and 3-level high voltage applications
Konferenz: PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.08.2024-30.08.2024 in Shenzhen, China
doi:10.30420/566414039
Tagungsband: PCIM Asia 2024
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Pluschke, Norbert
Inhalt:
The paper introduces an intelligent high-power SiC module with optimized driver design and low stray inductance. The SiC-driver has integrated short circuit protection and is optimized for different SiC chip technologies . High-performance heat sink will help to increase the power density. Also we will introduce a 3-level-design with intellligent high-power module with Si chips.