Applying of RC-IGBT using 300mm wafer to consumer use

Inhalt:
To improve productivity on semiconductor manufacturing processes enables to accelerate countermeasure for global warming. By changing wafer diameter from 200mm to 300mm, the productivity can be improved twice simply. Conventional RC-IGBT is applied 200mm wafer and is already installed to our SLIMDIP to achieve compact and inexpensive home appliance inverter system worldwide. RC-IGBT which is produced using 300mm wafer is installed in SLIMDIP as first trial. This paper introduces initial evaluation results that are equivalent to conventional electrical test results.