Comparison of Junction Temperature Measurement Methods for Power Module
Konferenz: PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.08.2024-30.08.2024 in Shenzhen, China
doi:10.30420/566414016
Tagungsband: PCIM Asia 2024
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Yang, Andrew; Liu, Yusi; Kim, Juyoung; Park, Robbie
Inhalt:
Junction temperature (Tj) of power device within the module must be checked to prevent damage from exceeding the rated temperature. This paper shows four ways to measure this temperature. The first method is through calculation. The second method is through simulation with ICEPACK. The third and fourth methods check the Tj through actual measurements with thermo-coupler (TC) wire and thermal camera. Finally, the Tj obtained by four methods are compared and analyzed so that an appropriate method can be used for the situation.