Robustness Analysis of Temperature-Sensitive Electrical Parameters of IGBTs
Konferenz: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11.06.2024-13.06.2024 in Nürnberg, Germany
doi:10.30420/566262425
Tagungsband: PCIM Europe 2024
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Schmitz, Laurids; Kojima, Tetsuya; De Doncker, Rik W.
Inhalt:
Temperature-sensitive electrical parameters (TSEPs) are a promising quantity for online high-bandwidth junction temperature measurements. Besides their sensitivity to temperature, these parameters are also susceptible to parasitic influences, such as dc-link voltage, load current, gate supply voltages, making their application challenging. Thus far, this has only been examined in a limited scope for individual parameters. Based on double-pulse measurements, this paper aims to evaluate and compare multiple TSEPs with regard to their robustness in the presence of such parasitic influences.