Fabrication of 600V RC-IGBT using 300mm Wafer
Konferenz: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11.06.2024-13.06.2024 in Nürnberg, Germany
doi:10.30420/566262413
Tagungsband: PCIM Europe 2024
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Ueno, Masaki; Oh, Shohta; Nakatani, Takahiro; Minamitake, Haruhiko; Hoshi, Taiki; Koketsu, Hidenori; Miyata, Yusuke; Asai, Yuta; Sugamoto, Ai; Suzuki, Kenji
Inhalt:
We have successfully manufactured 600V RC-IGBT using 300mm wafers with advanced wafer process. This device has not only comparable or better characteristics, but also less variation in electrical characteristics than the 200mm. We are now ready to provide a stable supply of power device to meet the growing demand for a wide range of applications from home appliances to automotive. Furthermore, we will be able to provide even higher performance devices in the future by using the fine pattern technology of 300mm wafer process.