Stability of Pressure Sintered Interconnects as a Function of Temperature and Environmental Conditions

Konferenz: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11.06.2024-13.06.2024 in Nürnberg, Germany

doi:10.30420/566262291

Tagungsband: PCIM Europe 2024

Seiten: 7Sprache: EnglischTyp: PDF

Autoren:
Yoshioka, Kentaro; Tsunoda, Mutsuharu; Michozuki, Akihiro; Fenech, Maurizio

Inhalt:
Performance and microstructural changes of pressure sintered silver die attach material are assessed following high temperature storage in different atmospheres and using different substrates. The aged joints are characterized using C-SAM and Electron Microscopy whereas the mechanical properties are assessed using Die Shear. The results show that oxygen has a strong influence on the residual strength of sintered joints and that the dense microstructure obtained by pressure sintering is stable following storage at 300 °C for 500 hours under N2 atmosphere. It is suggested that sintered joints have excellent stability in power modules packaged in high quality over-molding materials.