AI-Enhanced Vacuum Reflow Oven: Precision Control for Reliable Large-Area Soldering

Inhalt:
LED light source applications are becoming more and more widespread, and high-power components with large-area bonding (area > 20mm x 20mm) applications are growing rapidly in the automotive, aerospace, and other industries. In the past few years, silver sintering technology has become the subject of research for large-area bonding. However, this method is limited by the high cost of materials and the technical difficulty of the process environment. Tin-based solder paste bonding through proven re-flow technology and lower material costs offers a promising approach for mass production, but the critical issue of void control should be addressed. In this study, high-quality bonding with void content of less than 5% was achieved in large bonding areas up to 40mm x 40mm. Key process parameters such as temperature and vacuum were optimized to provide guidance for actual production.