Process Challenges and Progress Towards Direct Connectionof Automotive Power Modules (TMM) to Heatsink

Inhalt:
The direct connection of transfer molded modules (TMM) to a heatsink provides new opportunities for improving thermal performance and the supply chain at the system level. Two methods that could be used to perform direct connection are reflow soldering or sintering. This research focuses on the issues related to the mechanical robustness of TMM during the soldering process. The analysis of failed samples showed thermomechanical loading as the root cause of crack in EMC resin. To address this issue, a simulation-based sensitivity analysis was conducted to improve the design and material selection. The optimized assemblies were then subjected to thermal cycling tests, which confirmed their overall robustness. Additionally, the research considered other variables such as reflow equipment and soldering alloy selection.