Technological Approaches to High-Power Density SiC Power Module for Automotive
Konferenz: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11.06.2024-13.06.2024 in Nürnberg, Germany
doi:10.30420/566262104
Tagungsband: PCIM Europe 2024
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Tokorozuki, Takeshi; Komo, Hideo; Nishimura, Kazuhiro; Yoneyama, Rei; Majumdas, Gourab
Inhalt:
In recent years, environmental issues such as global warming have become increasingly serious. To address these problems, there is a global demand for the electrification of automobiles. One important aspect of electrification is the reduction of power module losses. We are developing a new series of power modules using SiC-MOSFET, which significantly reduce losses and improve power density compared to conventional Si-IGBT power modules. In this paper, we will describe the details of the new module series, including new heat dissipation technologies, functional integration for downsizing, and an extremely high-speed overcurrent protection method. Finally, we will investigate the application benefits provided from the perspective of loss reduction through power modules.