Investigating Temperature Dependent Warpage in Metal Ceramic Substrates for Power Electronics Devices

Inhalt:
This research investigates the temperature-dependent warpage behavior of metal ceramic substrates used in power electronics devices. It examines Active Metal Brazed (AMB) substrates with Silicon Nitride (Si3N4) ceramics and silver-based brazing material (Condura(r).prime), comparing them to innovative AMB 2.0 substrates (Condura(r).ultra). The AMB 2.0 technology addresses silver migration issues by using a Ag-free brazing paste. The study analyzes warpage outcomes of master cards and single units with different copper thicknesses, utilizing a comprehensive statistical method and Finite Element Method (FEM) simulations. It explores the impact of ceramic material variation and processing temperature on AMB substrate warpage. These findings contribute to better component selection and process parameter determinations for power electronics device assembly.