Wide Bandgap Semiconductor – a foundry perspective
Konferenz: PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
29.08.2023-31.08.2023 in Shanghai, China
doi:10.30420/566131029
Tagungsband: PCIM Asia 2023
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Wei, Heming (X-FAB Sarawak Sdn. Bhd. 1, Silicon Drive, Sama Jaya Free Ind. Zone, Kuching, Sarawak, Malaysia)
Jahnke, Agnes (X-FAB Global Services GmbH, Erfurt, Germany)
Inhalt:
This paper provides a concise overview of X-FAB and the power electronics markets, with a specific focus on the wide bandgap semiconductors Silicon Carbide (SiC) and Gallium Nitride (GaN). The potential advantages of using power electronics for achieving carbon neutrality will also be discussed. Additionally, the challenges associated with integrating SiC and GaN into a CMOS manufacturing process will be presented. Finally, the paper concludes by offering an outlook on X-FAB's technology strategy for power electronics.