Wide Bandgap Semiconductor – a foundry perspective

Konferenz: PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
29.08.2023-31.08.2023 in Shanghai, China

doi:10.30420/566131029

Tagungsband: PCIM Asia 2023

Seiten: 5Sprache: EnglischTyp: PDF

Autoren:
Wei, Heming (X-FAB Sarawak Sdn. Bhd. 1, Silicon Drive, Sama Jaya Free Ind. Zone, Kuching, Sarawak, Malaysia)
Jahnke, Agnes (X-FAB Global Services GmbH, Erfurt, Germany)

Inhalt:
This paper provides a concise overview of X-FAB and the power electronics markets, with a specific focus on the wide bandgap semiconductors Silicon Carbide (SiC) and Gallium Nitride (GaN). The potential advantages of using power electronics for achieving carbon neutrality will also be discussed. Additionally, the challenges associated with integrating SiC and GaN into a CMOS manufacturing process will be presented. Finally, the paper concludes by offering an outlook on X-FAB's technology strategy for power electronics.