Super High Heat Dissipation Resin Sheet by Card House Type BN Filler

Inhalt:
Ceramic substrates (DBC) have different CTE from copper and molding resin, and there were issues such as durability of the copper junction and warpage of the substrate during mounting. On the other hand, resin substrates (IMB) have improved these issues with CTE equivalent to copper, but its heat dissipation was not sufficient for high heat dissipation ceramic substrates such as Si3N4 and AlN. We have already mass-produced 16 W/m∙K sheet with our originally developed “Card-house structured BN filler”. Now, with further improvements, we are on track to commercialize 19 W/m∙K sheet. Mass pro-duction is under consideration. This sheet was found to have lower thermal resistance than Si3N4 or AlN substrates on thick copper heat-dissipating substrates and without base plate.