Investigation of a Non-Linear Two-Phase Immersion Cooling of Power Semiconductors
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091342
Tagungsband: PCIM Europe 2023
Seiten: 9Sprache: EnglischTyp: PDF
Autoren:
Gleissner, Michael; Maar, Lukas; Bakran, Mark-M. (University of Bayreuth, Department of Mechatronics, Center of Energy Technology, Germany)
Flieger, Bjoern (TLK-Thermo GmbH, Braunschweig, Germany)
Inhalt:
The possible improvement of the thermal impedance by direct and indirect immersion cooling of power semiconductor chips in different liquids is investigated. The non-linear behavior of the thermal impedance in the case of boiling is modeled and can be used to increase the power density or lifetime. In addition, the results of a 3D CFD simulation are compared with the laboratory measurements.