The Evolution of Commercial SiC FETs, from Planar Gates to Reliable Trench Technology and Towards Superjunction Devices
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091207
Tagungsband: PCIM Europe 2023
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Russell, Stephen (TechInsights, Canada)
Inhalt:
Products from the latest generation of commercially available silicon carbide (SiC) FET technologies are investigated, using cutting edge analysis techniques such as scanning capacitance microscopy (SCM), transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). We discuss the latest innovation and how technology has evolved to todays in some cases fourth generation SiC FETs, with a discussion on the merits of each variety. We review further advances necessary in processing techniques to achieve a true SiC superjunction device on a mass production scale.