New SMD-IPM: Explore How to Make Low-Power Inverter Design More Compact and Cost-efficient

Inhalt:
The intelligent power module (IPM) is a rapidly growing segment with high-growth inverter applications in home appliances. The more compact and cost-efficient inverter design needs to be, the more attention needs to be paid to surface mount device (SMD) type and its thermal management. This paper presents a new thermal-enhanced direct-bonded copper (DBC) substrate-cooled SMD-IPM for low-power motor drives which has extremely small package size and is able to greatly enhance the power density of the inverter. The module incorporates advanced reverse-conducting (RC) IGBTs for the effectiveness of a new package design as well as increased thermal performance. The line-up includes bottom and topside cooling packages.