Reliability and Thermal Analysis of ACEPACK SMIT Power Module
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091190
Tagungsband: PCIM Europe 2023
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Amoroso, Davide Maria (Università degli Studi di Catania, Italy & STMicroelectronics, Catania, Italy)
Mauromicale, Giuseppe; Calabretta, Michele; Sitta, Alessandro (STMicroelectronics, Catania, Italy)
Messina, Angelo Alberto (STMicroelectronics, Catania, Italy & National Research Council (CNR), Catania, Italy)
D'Arrigo, Giuseppe (National Research Council (CNR), Catania, Italy)
Sequenzia, Gaetano (Università degli Studi di Catania, Italy)
Inhalt:
Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACK(Trade Mark) SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.