Top-Side Cooling Packages: Disrupting Technology to BoostPower Density and Performance in High-End Power ConversionSystems
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091189
Tagungsband: PCIM Europe 2023
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Nardo, Domenico (STMicroelectronics, Germany)
Papaserio, Marco; Cavallaro, Daniela; Stella, Cristiano Gianluca; Orlando, Stefano; Longo, Ludovica; Sorrentino, Giuseppe (STMicroelectronics, Italy)
Inhalt:
This paper analyzes the thermal performance of silicon MOSFETs housed in surface-mount (SMD) packages both with top-side and bottom-side cooling. Using a mathematical method to estimate the power losses and thermal simulations, we demonstrate how the top-side cooling thermal dissipation approach can help reduce the junction temperature and lower the power losses thanks to a smoother variation, caused by temperature changes, of the main silicon MOSFET parameters, such as RDS(on) and Vth level.