Manufacturing Method of Copper Nanowired Interconnections for Embedding Power Dies in PCB
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091123
Tagungsband: PCIM Europe 2023
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Mendes, Caio C. O. (Mitsubishi Electric R&D Centre Europe, France & LAPLACE, University of Toulouse, France)
Morand, Julien (Mitsubishi Electric R&D Centre Europe, France)
Bley, Vincent; Cambronne, Jean-Pascal (LAPLACE, University of Toulouse, France)
Inhalt:
A method to produce a nanowired interconnection is presented. This bonding method for power die, provides elasticity to the assembly while offering a good electrical and thermal path compared to the established laser microvias. Experimental results demonstrate a well-distributed nanowire growth at the surface, which leads to a bond with a heat extraction and a current conduction similar to existing die attachment solutions, such as silver sintering.