Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091110
Tagungsband: PCIM Europe 2023
Seiten: 10Sprache: EnglischTyp: PDF
Autoren:
de Vienne, Cedric Mathieu (SuperGrid Institute, CS 50289, Villeurbanne Cedex, France & Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELAB, Grenoble, France)
Asllani, Besar; Reynes, Hugo; Guillet, Martin; Lefebvre, Bruno (SuperGrid Institute, CS 50289, Villeurbanne Cedex, France)
Al-Hinai, Amin; Huesgen, Till (Electronics Integration Laboratory, Kempten University of Applied Sciences, Germany)
Lefranc, Pierre; Jeannin, Pierre-Olivier (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELAB, Grenoble, France)
Buttay, Cyril (Univ Lyon, CNRS, INSA Lyon, Université Claude Bernard Lyon 1, Ecole Centrale de Lyon, Ampère, UMR5005, Villeurbanne, France)
Inhalt:
Tests are carried out on two different series-connected switches made of six SiC MOSFETs capable of blocking 10 kV and 20 kV respectively. High voltage capacitors are connected to the drain terminals of the MOSFETs to emulate the common mode currents’ paths due to parasitic capacitances of the packaging. Due to high dV/dt, common mode currents become dangerous to the switch as they unsettle the voltage sharing during turn-off and unbalance switching losses. This could lead some of the MOSFETs to experience avalanche breakdown. A novel packaging approach that suppresses or balances the common mode currents is introduced.