Bonding Properties and Reliability Evaluation of Cu Sinter Paste for Pressure Sintering

Inhalt:
The bonding material of power semiconductor devices requires high thermal durability, conductivity and reliability. Much is expected from Cu sinter materials for bonding because they can meet these requirements. In this study, we investigated bonding properties, die backside metallization compatibility and reliability of our Cu sinter paste. It was confirmed that it provides good bonding and is compatible with Au and Ag metallized layers. It was also found that the bonding sample maintains a good bonding state even after Thermal Cycling Test (TCT) and High Temperature Storage (HTS) test. These results suggest that our Cu sinter paste can be a bonding material for power semiconductor devices.