Towards a Modular Multilevel Flying Capacitor Module using SiC MOSFETs
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091009
Tagungsband: PCIM Europe 2023
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Sanjakdar, Omar (Univ. Grenoble Alpes, CEA, LITEN, INES, Le Bourget du Lac, France & Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France)
Alves Rodrigues, Luis Gabriel (Univ. Grenoble Alpes, CEA, LITEN, INES, Le Bourget du Lac, France)
Avenas, Yvan (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France)
Inhalt:
In this paper, a novel modular power module layout suitable for multilevel flying capacitor topology is proposed. Issues associated with the module layout are addressed through electromagnetic simulations (Ansys Q3D Extractor). Then prototypes of three-level flying capacitor modules are presented. Stray inductances’ measurements are carried out using a precision impedance analyzer. Their values are also estimated based on the free-oscillating waveforms between the decoupling capacitors and the stray inductances. Thanks to the proposed design approach, the stray inductances of each switching cell are well balanced and close to 6 nH.