Thermal Evaluation of SiC MOSFET Power Modules with HPD Package and Double-sided Cooling Package
Konferenz: PCIM Asia 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.10.2022 - 27.10.2022 in Shanghai, China
Tagungsband: PCIM Asia 2022
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Li, Huakang; Ning, Puqi (Institute of Electrical Engineering Chinese Academy of Sciences, China & University of Chinese Academy of Sciences, China)
Kang, Yuhui (Institute of Electrical Engineering Chinese Academy of Sciences, China)
Inhalt:
This paper aims to compare the thermal performance between a conventional HPD package and a double-sided cooling (DSC) package of SiC MOSFET power module. An electro-thermal analysis was studied and experiments were conducted to evaluate their capability of current conduction. To understand the failure of DSC module, the matching of heatsinks and a module at interfaces was studied. A conceptual DSC module with pinfin heatsink is proposed.