Influence of TIM and Encapsulation on Power Cycling Capability of Discrete Devices
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822283
Tagungsband: PCIM Europe 2022
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Zhao, Yushan; Xie, Luhong; Liu, Jianhui (State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (North China Electric Power University), China)
Deng, Erping; Huang, Yongzhang (State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (North China Electric Power University), China & NCEPU (Yantai) Power Semiconductor Technology Research Institute Co., Ltd, China)
Inhalt:
Whether different encapsulations and TIMs for TO-package IGBT influences the lifetime is studied. Based on the TO-247 lifetime model, the influence of TIMs thermal gap filler, ceramic, and PCB on lifetime is studied by several PCTs, furthermore, whether lifetimes of TO-263 and TO-220 conform to the lifetime model is also studied. After normalizing lifetime by FE simulation, the results show that TO-247 and TO-220 have similar lifetimes, but TO-263 has longer lifetimes, furthermore, devices with PCB or gap filler have similar lifetimes, but devices with ceramic have shorter lifetimes due to friction.