On the Importance of Thermo-Mechanical Properties Mismatch Management on Power Module to Cooler System Attachment

Inhalt:
System level joining technologies turn out to be the bottleneck when high reliability and high operation temperatures are required. In this paper, the impact of the sintering technology is investigated for different cooler materials attached to large scale power modules (~50 x 50 mm). From finite element analysis (FEA) to experimental work, the stress behavior of system level attachment is evaluated. FEA demonstrated the different behavior of the selected system level materials (Al, AlSiC and Cu) in terms of warpage and accumulated plastic strain. The experimental approach confirmed the FEA results as only AlSiC and Cu system level materials achieved the required 1000 TST (Temperature Shock Test) cycles without any defect.