Analysis of Decoupling Capacitor Effectiveness for Multi-Chip Power Modules

Inhalt:
The increased edge rates of wide bandgap (WBG) semiconductors require heightened attention while designing systems to ensure device ratings are not exceeded and to achieve optimal performance. In many applications, it is common practice to attach decoupling capacitors as close as possible to a semiconductor module to protect the device from excessive voltage transients. In some applications, particularly in characterization measurements of multi-chip power modules (MCPM), decoupling capacitors introduce several challenges which undermine their usefulness. This paper discusses these challenges and provides simulation and empirical evidence to indicate that decoupling capacitors are not recommended in most situations when characterizing MCPMs.