Study of Combined Solutions for Thermal Management and Electromagnetic Shielding: Shielding Cabinets, EMI Absorbers and Thermal Gap Fillers

Inhalt:
Thermal Management and Electromagnetic Interferences (EMI) Shielding are two important topics that need to be taken into account in the design process of an electronic device, although sometimes it is necessary to find a common ground for them. This article studies new approaches which mix both topics and compares them with classical solutions. Different combinations of shielding cabinets, a new EMI absorber and thermally conductive material and a classical thermal gap filler pad will be presented and analyzed in order to give the reader a general idea of the performance and advantages/disadvantages of these materials and combinations when using them to solve EMI and heat issues.