Improving the Performance of DC-DC Converters by Using SMDPackages with Top-Side Cooling
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822125
Tagungsband: PCIM Europe 2022
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Papaserio, Marco; Nardo, Domenico; Orlando, Stefano; Stella, Cristiano Gianluca; Cavallaro, Daniela (STMicroelectronics, Italy)
Inhalt:
This paper analyzes the efficiency of silicon MOSFETs in SMD packages with top-side cooling compared to bottom-side cooling packages in terms of thermal performance, lowering both thermal resistance and operating temperatures. It will show how reducing the junction temperature helps to boost power efficiency due to a smoother variation of the main silicon MOSFET parameters due to temperature changes such as RDS(on) and Vth level as well as reduces total conduction and switching losses.