Thermal Analytical Modelling of the Heat Transfer Through a Power PCB Dedicated to a High Current Density Modular Converter
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822124
Tagungsband: PCIM Europe 2022
Seiten: 9Sprache: EnglischTyp: PDF
Autoren:
Pongnot, Gael; Adam, Fabien (Universit Âe Paris-Saclay, ENS Paris-Saclay, CNRS, SATIE, 91190, Gif-sur-Yvette, France)
Petit, Mickael; Mayet, Clement; Labrousse, Denis (Universit Âe Paris-Saclay, ENS Paris-Saclay, CNRS, SATIE, 91190, Gif-sur-Yvette, France & SATIE, UMR 8029, Cnam, HESAM Universite, Paris, France)
Duluc, Marie-Christine (Lafset, Cnam, HESAM Universite, Paris, France)
Inhalt:
This work is based on an innovative converter structure for an automotive application. A major constraint is the cooling. A nondimensionalization and an analytical resolution of a thermal problem applied to power electronics are proposed. A study of the influence of the geometrical parameters on thermal resistance is carried out to understand the underlying phenomena. Two sizing methods are proposed, based on charts calculated from the proposed resolution. An example of an application based on the initial problem is presented and compared to a finite element simulation.