ShowerPower® 3D – Highest Power Density for Future Generation of SiC Power Modules

Inhalt:
This paper elaborates on how to thermally optimize a power module design for direct liquid cooling. Particular focus is placed on the patented ShowerPower(r) 3D (SP3D(r)) technology and the base plate design of a 1200V, 660A full-SiC half-bridge module, a leading variant within Danfoss’ DCM(TM) 1000X technology platform. After describing how cooling optimization can be conducted, an optimization of a pinfin design for a given installation space is demonstrated. The resulting Pareto plots for a serial and a parallel pinfin solution are then compared to the actual SP3D(r) solution. Since the optimization is based on numerical simulations, a set of measurements is presented to validate the simulative results of the study. In conclusion, this paper reveals the outstanding low thermal resistance of SP3D(r), developed to achieve highest power densities in automotive traction inverters.