A Reliability Study of Phase Change Thermal Interface Materialsfor Power Semiconductor Modules

Inhalt:
Phase change thermal interface materials (PCTIMs) are being increasingly used as replacement for thermal grease to improve the efficiency of heat dissipation and long-term reliability. Though the PCTIM market is well-established, it is vital to ensure that the materials are compatible with the power modules in terms of processing, performance and reliability. In this paper, reliability of phase change printable pastes were compared with application in IGBT modules. Long-term reliability tests were carried out to understand the performance of the PCTIMs on a module-heatsink configuration.