Direct-Liquid-Cooled Next High Power Density Dual (nHPD2) using Copper Base Plate

Inhalt:
A direct-liquid-cooled standard power module based on Hitachi’s next High Power Density Dual (nHPD²) adopting a copper base plate has been developed for the purpose of reducing inverter system cost. The water pressure resistance of the power module was improved to 0.4 MPa through reinforcement of the base plate surrounding the pin fin region. Thermal resistance of the direct-liquid-cooled nHPD² was found to be reduced to less than 60% that of the conventional indirect-liquid-cooled nHPD² and the rated current can be improved by 1.5 times. In the industrial application such as wind power generation the phase current can also be improved by more than 1.3 times. It shows that cost reduction can be achieved by reducing the number of power modules installed.