Silver Sintering on PCBs – Methods and Reliability
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822084
Tagungsband: PCIM Europe 2022
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Dresel, Fabian; Mueller, Jonas; Leib, Juergen; Schletz, Andreas (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany)
Inhalt:
Conventional joining technologies like soldering or glueing are limited for the assembly of power semiconductors on PCB. This work describes two concepts for sintering of power semiconductors onto PCB. The principles of selective silver sintering and sinter paste jetting are discussed. Samples are fabricated utilizing both methods and power cycling tests are carried out to assess their reliability. Especially the jet printed samples show promising reliability results. No effect of the temperature cycles on surrounding components was observed.