Bonding Properties and Reliability Evaluation of Cu Paste in Low Temperature Pressureless Sintering
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822065
Tagungsband: PCIM Europe 2022
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Yamauchi, Shinichi; Konno, Satoshi; Hattori, Takashi; Anai, Kei (Business Creation Sector, Mitsui Mining & Smelting Co., Ltd., Japan)
Inhalt:
We evaluated the bonding properties and reliability of the newly developed Cu paste for low temperature pressureless sintering. Sintered at 200deg C for 60min in a pressureless formic acid atmosphere, this paste produced high shear strength, good bonding state, and no voids. These results suggest that the developed Cu paste is a promising material.