A New Level of Performance: Best-in-Class 900 A and 750 A 1700 V EconoDUAL(TM) 3 Modules with TRENCHSTOP(TM) IGBT7

Inhalt:
The semiconductor market continues to push IGBT technologies to reach new levels of power density, robustness, and performance. At the same time, for the new IGBT generation there is always a need for a product that can be designed into devices with minimal effort and that performs well in a variety of applications. Additionally, the IGBT must be suitable for creating a scalable inverter portfolio with optimized system costs. In this publication, a new Infineon TRENCHSTOP(TM) 1700 V IGBT7 technology, and correspondingly, the new best-in-class 900 A and 750 A EconoDUAL(TM) 3 modules are compared with the Infineon IGBT4 technology in terms of electric and thermal behavior using simulations and application-based tests. Chip optimization was considered in the context of applications specific to 1700 V IGBT modules. The results show that modules with the new 1700 V IGBT7 / EC7 technology achieve significantly increased power densities in a wide range of applications.