Benefits of SiC in On-Board Charger Applications

Inhalt:
High power automotive applications such as on-board-charger (OBC) or high voltage to low voltage (HV-LV) DCDC converters face various challenges at the system level such as, increased power density, increased level of integration, higher switching frequencies and increased efficiency. 1200 V SiC MOSFETs are key components used in high voltage OBC/DCDC application to overcome these system challenges. Both technology and package play an important role. This paper discusses the aspects of a 1200 V SiC MOSFET technology, especially designed for high switching applications that can bring benefits at the system level, the different surface mount package solutions, and explains how a well-known bottom side cooled D2PAK solution can be adopted to fulfill the high voltage application conditions. Furthermore, this paper highlights a new type of power package with top-side cooling capability that enables HV systems to reach higher power densities in next generation OBCs.